Plasma-resistant high-purity yttrium oxide (Y₂O₃) material and component coating process technology for semiconductor process

In order to improve competitiveness in the semiconductor equipment industry, line width miniaturization and high integration are continuously being carried out. Since most of these processes are carried out in various plasmas, active gases, and high process temperatures, they are always exposed to the risk of corrosion on the parts (endodermis) in the equipment.
In order to solve this problem, the entire amount of yttrium oxide (Y₂O₃) material for coating is imported, and corrosion of the endothelium is prevented through ceramic coating using plasma spraying. However, the coating film is rough because the process is carried out at atmospheric pressure, and there are numerous pores inside the film, which is not dense.
We have secured a coating technology that applies the EB-PVD thin film process that can improve etch resistance and yield/productivity to improve problems such as increasing time and leading to a decrease in production yield.
It is attracting semiconductor component coating demand and related customers, and is commercializing it through close cooperation.